(ㄱ) 기초면을 10 ∼ 20mm 정도 CHIPPING하고, 압

(ㄱ) 기초면을 10 ∼ 20mm 정도 CHIPPING하고, 압축공기 등으로 이물질을 완전 제거한다.

ผลลัพธ์ (อังกฤษ) 1:

(P) if the basis of 10-20mm about CHIPPING, compressed air, and debris that are completely removed.

ผลลัพธ์ (อังกฤษ) 2:

(A) CHIPPING 10 ~ 20mm about the base surface, and completely remove the foreign substances in the compressed air.

ผลลัพธ์ (อังกฤษ) 3:

( "If the foundation for a 10 - 20 mm CHIPPING, compressed air, and completely removes debris.